Diamond Grinding Wheel Fitting
Zhenjiang Reco New Material Co., Ltd.- Material：Diamond
- Abrasive：Superabrasive
- Shapes：Section Shape
- Types：Surface Grinding Wheel
- Grain Size：240#
- Cylindricity：<0.05
Base Info
- Circular Degree：<0.05
- Technics：Diamond
- Working Style：Surface Grinding
- Diameter：300mm
- Thickness：50
- Hole Diameter：48
- Diamond Grit：200#
- Type of Technical：Hot Press
- Transport Package：Carton
- Specification：SGS
- Trademark：RECO
- Origin：China
- HS Code：8207201000
- Production Capacity：50000PCS,Year
Description
Diamond grinding wheels for the surface of silicon ingot grinding before cutting waffer.
The surface of silicon ingot will be better after grinding.
Try it,and you will love it!
Customized size available on request.