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Ez Change S Series HTC Grinding Shoes for Floor Grinder
Grinding ForConcrete, stone and terrazzoSegment height10mm (12mm, 15mm also provide)Grit16#, 30-220#, 350#, 400#BondSoft, Medium, HardWeb:sunnytools.en.made-in-china.comWe supply many kinds of grinding pad HTC, Klindex, Blastrac, Deco, Lavina,Scanmaskin, etc. Contact us, we will show you somequality
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High Alumina Grinding Media Ball From 1mm-100mm with 90%, 92%, 95% Al203
High Alumina Grinding Balls923.650.0190.011953.680.00590.0084Appearance DemandCrackNot PermissionNot PermissionNot PermissionImpurityNot PermissionNot PermissionNot PermissionFoam holeAbove 1mm not permission, size in 0.5mm permit 3ballsFlawMax. size in 0.3mm permit 3ballsThe standard specification3
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Abrasive Tool Diamond Resin Bond Stone Polishing Pad
OutDiameterGritTypeInchMM3''8050#,100#,200#,400#,800#,1500#,3000#Dry/Wet4''10050#,100#,200#,400#,800#,1500#,3000#Dry/Wet5''12550#,100#,200#,400#,800#,1500#,3000#Dry/Wet6''15050#,100#,200#,400#,800#,1500#,3000#Dry/Wet7''18050#,100#,200#,400#,800#,1500#,3000#Dry/WetAbout us:Huazuan Diamond Tools Co. L
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Metal Bond Diamond Fickert for Granite Grinding
Basic Info. Model NO. SY-DF-1000( Diamond Fickert)
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Arrow Segment Diamond Concrete Floor Grinding Disc Abrasive Block for HTC Grinder
Products DescriptionProduct Name:HTC diamond concrete floor grinding segmentItem No.:DMY-74Brand:Extra SharpFeatures:1) Segment No.: 22) Segment size: 10 mm height3) Grit: 16#, 18/20#, 30/40#, 60/80#, 120/150#. soft, medium, hard bond 4)Application: for grinding and polishing m
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100mm Black Buff Pads Wet Dry Used Resin Bond Buff Polishing Pads
Products Description:Product Name:Resin Bond Wet Polishing Buff PadsItem No.:BUFFBrand:Extra SharpFeatures:1) Grit: buff2) Final step for polishing marble, granite, glass and otherstones3) Suitable for the polishing process of the curved or polygon surfaceSpecification:Outer DiameterHolderGritThickn
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Double Rhombus Segment Diamond Grinding Pad for Concrete
Basic Info. Model NO. DMY-72
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Casting Grinding Ball for Cement Plant, Power Plant
Chemical ComponentsTypeChemical componentsCSiMnCrMoCuPSLow-Cr1.8-3.3≤1.50.3-1.51-3≤1.0≤0.8≤0.10≤0.10Medium-Cr1.8-3.3≤1.20.3-1.54-9≤1.5≤0.8≤0.10≤0.10High-Cr1.8-3.3≤1.20.3-1.510-18≤1.0≤1.2≤0.10≤0.06Superhigh-Cr1.8-3.3≤1.20.3-1.519-35≤2.0≤1.2≤0.