High Effective High Quanlity Customized Dimond Grinding and Lapping Fluid for Alloys and Optical Glass
SINO ZHENG INDUSTRIAL INC.- Type：Diamond
- Classification of Diamond：Artificial
- Characteristic：Silicon Carbide, Diamond
- Characteristics of Natural Diamond：Grinding and Polishing
- Application：Polishing of Magnetic Recording Material
- Feature：High Efficiency
Base Info
- Model NO.：HID NDS
- Types：Abrasive
- Usage：Surface Polishing
- Auxiliary Equipment：Polishing Pad, Grinding Disc
- Transport Package：Bottle
- Specification：500 ml per Bottle
- Trademark：Harmony
- Origin：Zhengzhou China
- HS Code：34059000
- Production Capacity：80, 000 Liter
Description
Application:
Semiconductor wafer polishing: single crystal silicon wafer, polycrystalline silicon wafer, sapphire wafer, silicon carbide wafer, etc.;
Polishing of magnetic recording materials: computer hard disk substrates, computer hard disk heads, etc.
Single Crystal Diamond Slurry Grade HID-SDS
Feature:
Selected particle shapes
Strict granularity control
Unique formulations for different applications.
Specification:
Application:
1. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials
2. Other material processing: optical glass, cemented carbide, etc.
Polycrystalline Diamond Slurry Grade HID-PDS
Feature:
Selected polycrystalline diamond abrasives;
High cutting force and good surface processing effect can be achieved in the processing of high hardness wafers;
A variety of carriers are available for different processing areas.
Specification:
Application:
1. Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
2. Ceramic processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
3. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.
Polycrystalline-Like Diamond Slurry Grade HID-PLDS
Feature:
It is an economical alternative to polycrystalline diamond slurry;
The grinding effect of polycrystalline diamond slurry can be achieved in the processing of various semiconductor wafers.
Specification:
Application:
Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
Ceramic material processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.
