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Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction

Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.
  • Material：Diamond
  • Abrasive：Normal Abrasive
  • Standard：Customized
  • Grinding Plate Material：Dimond
  • Usage：Surface Grinding and Polishing
  • Feature：High Accuracy and Efficiency

Base Info

  • Model NO.：KPZ-9
  • Application：Manufacturing
  • Precision：1 Micron
  • Transport Package：Standard Export Packing
  • Specification：Customized
  • Trademark：KIZI
  • Origin：Dongguan, China
  • Production Capacity：10 Pieces,Month

Description

Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness ReductionDimond Grinding and Lapping Disc for Adjusting Gasket Thickness ReductionNote:*Different grinding disc diameters for different machine models.

Grinding and Lapping CasesDimond Grinding and Lapping Disc for Adjusting Gasket Thickness ReductionDimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction


Related Product Introduction

Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness ReductionDimond Grinding and Lapping Disc for Adjusting Gasket Thickness ReductionDimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction

Synthetic Iron Plate

    This product is used for fast coarse grinding for more allowance products, cooperate with coarse partical diamond grinding fluid will be high efficiency, but the grinding surface will be more coarse.
Company Introduction
Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction        Dongguan KIZI Precision Grinding machinery Manufacturing Co., Ltd. Was established in 2010, mainly research and development, production, manufacturing, sales of high precision plane grinding machine, precision plane polishing machine and other CNC equipment and their matching consumables.
        Our company offers variety of products which can meet your multifarious demands. We adhere to the management principles of "quality first, customer first and credit-based" since the establishment of the company and always do our best to satisfy potential needs of our customers. Our company is sincerely willing to cooperate with enterprises from all over the world in order to realize a win-win situation since the trend of economic globalization has developed with anirresistible force.
        Our products are widely used in the grinding and polishing process of metal and non-metal (including ceramic, sapphire window sheet and substrate sheet, silicon carbide substrate, gallium nitride wafer, silicon wafer and other semiconductor materials), and the workpiece can obtain the best flatness of 1μ m and the roughness of 0.01μm.

PatentsDimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction
Exhibition
Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction
Our Service
1. Factory with competative price,high quality and stability.
2. R&D Dep. with 20 technicians, 5 of them in decades experience.
3. Free charge of customer sample making.
4. Completed After sales service and expertise support from Taiwan.

Packing & Delivery
Packing Details  : Packing, 1 pcs/carton.
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Dimond Grinding and Lapping Disc for Adjusting Gasket Thickness Reduction
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.