Abrasive & Grinding

99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing

Pingxiang Chemshun Ceramics Co., Ltd.
  • Type:Disc Grinder
  • Power Source:Chemical Mechanical Polishing
  • Object:Wafer
  • Application:Semiconductor
  • Disc(Wheel) Type:Polishing Plate
  • Material:Alumina Ceramics

Base Info

  • Model NO.:Alumina Ceramic Wafer Polishing Plate
  • Working Style:Chemical Mechanical Polishing
  • Disc Diameter:Within 850mm
  • Transport Package:Carton and Wooden Box
  • Specification:size below ∅ 850mm, thickness 45mm.
  • Trademark:Chemshun Ceramics
  • Origin:China
  • HS Code:6909191200
  • Production Capacity:500pic ,Month

Description

Volume Resistivityohm-cm (25ºC)>10^14ohm-cm (500ºC)2x10^12ohm-cm (1000ºC)2x10^7

  

99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing


99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing
99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing
99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing