Abrasive & Grinding

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Ganzhou Wanfeng Advanced Materials Technology Co., Ltd.
  • Material:Polishing Powder
  • Usage:Polishing, Grind
  • Customized:Customized
  • Color:White
  • Product Name:Polishing Powder
  • Other Name:Abrasive Powder

Base Info

  • Model NO.:REP-21
  • Appearance:White Yellowish Powder
  • Main Content:Cerium Oxide
  • Treo:98%
  • CEO2/Treo:99.95%
  • F Content:0
  • Particle Size D50:0.6 Micron
  • Particle Size D100:5 Micron
  • Solubility in Water:Insoluble
  • Transport Package:1000kg,Bag
  • Specification:cerium oxide polishing powder
  • Trademark:Wanfeng
  • Origin:Jiangxi, China
  • HS Code:2846101000
  • Production Capacity:500metric Tons,Month

Description

Basic Info.

Model NO. REP-21 Appearance White Yellowish Powder Main Content Cerium Oxide Treo 98% CEO2/Treo 99.95% F Content 0 Particle Size D50 0.6 Micron Particle Size D100 5 Micron Solubility in Water Insoluble Transport Package 1000kg/Bag Specification cerium oxide polishing powder Trademark Wanfeng Origin Jiangxi, China HS Code 2846101000 Production Capacity 500metric Tons/Month

Product Description

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 micron
Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Code: REP-21

Name: Cerium Oxide Polishing Powder

TREO:  ≥ 98%

CeO2/TREO: 99.95%

Color: white

F: 0

PH: 7

Particle size: D50:0.6±0.2μm, D100<5μm

Appearance: white yellowish powder
 

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron 

Characteristics:

1. With great cutting force and long service life, the polishing speed is fast;

2. With good suspension and dispersion, there is non adhesion and easy cleaning.

3. With good consistency, the particle size distribution is uniform.

4. With excellent hand feel and stable quality, it will create no scratch.

 

Application:
1. For precision polishing of larger flat crystal and diamond products.
2. For the polishing of optical components and mobile covers with general precision requirements.
3. For the polishing of mobile phone covers, flat glass or optical glass with higher precision requirements. For example, the polishing of glass substrates for TFT-LCD.
4. For the precision polishing of optical components, silicon wafers and large glass covers with high precision requirements. 
5. For the polishing of large flat glass, silicon wafers and optical glass with higher precision requirements.
6. For precision polishing of optical components with high precision requirements, or polishing of large LCD screen.

Tips:
1. The polishing by the polishing slurry with the concentration of 10% can get higher polishing efficiency and quality.
2. This product shall be stored in a cool dry place.


Specifications

Rare Earth Polishing Powder

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron
Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron

Stable Pure Cerium Oxide Polishing Powder with D50 0.6 Micron